High-Temperature Crosslinkers for Polyimides
Nexam Chemical offers advanced crosslinking end-cappers and monomers designed for high-performance polyimide systems.
Our solutions enable improved thermal stability, increased glass transition temperature (Tg), and enhanced chemical resistance for demanding applications.
Meeting the demands of high-temperature applications
Polyimide systems used in aerospace, electronics, and advanced composites must withstand extreme temperatures, harsh environments, and long-term mechanical stress.
Standard formulations often face limitations in thermal stability, processability, or final performance.
Tailored crosslinking for polyimide systems
Nexam Chemical provides a range of high-temperature crosslinking end-cappers and monomers that enable controlled crosslinking within polyimide systems.
By introducing reactive sites into the polymer backbone, our solutions allow precise tuning of curing behavior and final material properties.
Improved performance through controlled crosslinking
Key effects of crosslinking
- Increased glass transition temperature (Tg)
- Improved chemical and heat resistance
- Enhanced mechanical strength and durability
- Adjustable curing temperatures
- Tailored performance for demanding environments
Neximid® crosslinkers
The Neximid® portfolio includes a series of crosslinking end-cappers with different curing temperature ranges, allowing formulators to tailor reactivity and processing conditions.
| Trade name | Chemical name | CAS # | Typical curing range |
|---|---|---|---|
| Neximid® 100A | 4-Phenylethynylphthalic anhydride | 119389-05-8 | ~330–400°C |
| Neximid® 200 | 4-Ethynylphthalic anhydride | 73819-76-8 | ~230–290°C |
| Neximid® 300 | 5-(3-Phenylpropioloyl)-1,3-isobenzofurandione | 1329658-14-1 | ~190–230°C |
| Neximid® 400 | 4,4´-(1,2-Ethynyl)bisphthalic anhydride | 129808-00-0 | ~380–440°C |
| Neximid® 500 | 4-Methylethynyl phthalic anhydride | 1240685-26-0 | ~280–330°C |
Monomers for polyimide synthesis
In addition to crosslinkers, Nexam Chemical offers key monomers for polyimide production, such as:
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NEXAMITE® B02 (PMDA) — Pyromellitic dianhydride CAS#829-32-7
Used in the synthesis of polyimides and high-performance materials requiring excellent thermal and structural stability.
Applications in high-performance systems
Typical applications
- Polyimide prepregs
- Polyimide varnishes and coatings
- Aerospace composites
- Electronics and insulating materials
- High-temperature adhesives and resins
Flexible curing profiles
With a broad range of curing temperatures, the Neximid® portfolio allows formulators to balance processing conditions, reactivity, and final performance.
This makes it possible to optimize materials for specific applications and manufacturing setups.
Why choose Nexam Chemical
- Unique portfolio of high-temperature crosslinkers
- Tunable curing chemistry
- Strong expertise in reactive polymer systems
- Support from formulation to application
- Reliable quality and global availability
Develop high-performance polyimide systems
Contact us to explore how Neximid® crosslinkers and NEXAMITE® monomers can enhance your polyimide formulations and enable next-generation high-temperature materials.
Discuss your application
Share your material, process, or requirements — our team will help you find the right solution.
Contact us for more information
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