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Nexam Chemical introduces NEXIMID® MHT-R

10/03/2014

– “easy to process” polyimide resin for high temperature applications

Nexam Chemical introduces NEXIMID® MHT-R a new ”easy to process” resin for use in high temperature applications, with Tg above 400° C. The resin is primarily intended for use in Resin Transfer Molding (RTM) of high temperature composite parts for the aerospace industry. Other areas, such as machine manufacturing industry and different transport sectors will also benefit from this material where metal replacement of parts exposed for high temperatures are possible. 

“Our new product, NEXIMID®MHT-R, creates vital benefits for both composite manufacturers and end users. It allows automation with higher levels of productivity and quality control instead of today’s labour intensive process, which leads to huge savings of time and cost for manufacturers. The end customers will benefit from a higher level of sustainability and lower costs compared to the metal-based applications in use today, due to lower weight and avoiding metal fatigue among other things”, says Jan-Erik Rosenberg, Director of Commercial & Market Development at Nexam Chemical.  

NEXIMID®MHT-R is a polyimide resin which is based on Nexam Chemical’s crosslinkers NEXIMID®100 (PEPA) and the Nexam Chemical unique NEXIMID®400 (EBPA) in combination with other high temperature resistant monomers.

The resin has a unique combination of advantages such as:

    A high softening temperature (Tg): from 330°C and up to 420⁰C via post-curing. This is superior to most other materials and polyimides on the market.
    Very low melt viscosity at processing temperatures: Enables superior processing properties.

The above unique combination of advantages makes it suitable for manufacturing of high-temperature composites with RTM technology, which is beneficial from both a time and cost perspective for the users.

Samples of NEXIMID® MHT-R resin is available today. Please visit http://nexamchemical.com/en/Products/For-Polemider/NEXIMID-MHT-R/ for more information.

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