News: Nexam Chemical’s product NEXIMID 500 (MEPA) in new Japanese patent
01/13/2014
The Japanese company Nishino has received a patent from the Japanese Patent Office (JPO) where Nexam Chemical’s product NEXIMID 500 is used in a polyimide. The resin has been found to provide excellent thermal properties and solubility in combination with very good flexibility which is unique. Moreover, the resins can be crosslinked at 50-80 °C lower temperatures compared to other types of phenylethynyl based crosslinkers, which require significantly higher crosslinking temperatures. Generally, there are few other thermoset systems that can show elongation at break (a measure of flexibility) over 10%, but PETI resins are such a material with almost 20% elongation at break. In this patent an example of almost 40% is presented.
“Increasingly we find out that new patents, based on Nexam Chemical’s new crosslinkers, are being granted around the world. This is another sign of strength for Nexam Chemical and proof that our technology is spreading across the world…”, says Per Palmqvist Morin, CEO.
The patent can be read at the following link: http://worldwide.espacenet.com/publicationDetails/originalDocument?CC=JP&NR=2013241553A&KC=A&FT=D&ND=3&date=20131205&DB=worldwide.espacenet.com&locale=en_EP
Note: This news has been translated from Swedish. The Swedish text shall govern for all purposes and prevail in case of any discrepancy with the English version.